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| 1 motorola sensor device data $"$ "##%" # " ! $ !"$%" ! #$ "$ the mpx5010/mpxv5010g series piezoresistive transducers are stateoftheart monolithic silicon pressure sensors des igned for a wide range of a pplications, but particularly those employing a microcontroller or microprocessor with a/d inputs. this transducer combines advanced micromachining techniques, thinfilm metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. features ? 5.0% maximum error over 0 to 85 c ? ideally suited for microprocessor or microcontroller based systems ? durable epoxy unibody and thermoplastic (pps) surface mount package ? temperature compensated over 40 to +125 c ? patented silicon shear stress strain gauge ? available in differential and gauge configurations ? available in surface mount (smt) or throughhole (dip) configurations application examples ? hospital beds ? hvac ? respiratory systems ? process control figure 1. fully integrated pressure sensor schematic * ' '"' " !"( * 7<; " ( " ! (!$&()& #!$"'( #" " " '( " '( " &#)" &&" ' ( &) (&- $ "' " ( &#) & "# #""(' #& ')& !#)"( $ $ "' " & "# #""(' #& )" #- $ order this document by mpx5010/d
semiconductor technical data ? motorola, inc. 2001 mpxv5010gc7u case 482c mpxv5010gc6u case 482a mpxv5010g6u case 482
integrated pressure sensor 0 to 10 kpa (0 to 1.45 psi) 0.2 to 4.7 v output small outline package pin number note: pins 1, 5, 6, 7, and 8 are internal device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. 1 2 3 n/c v s gnd 5 6 7 n/c n/c n/c 4v out 8 n/c unibody package mpx5010d case 867 mpx5010dp case 867c pin number note: pins 4, 5, and 6 are internal device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. 1 2 3 v out gnd v s 4 5 6 n/c n/c n/c mpx5010gs case 867e rev 8 2 motorola sensor device data maximum ratings (note) parametrics symbol value unit maximum pressure (p1 > p2) p max 75 kpa storage temperature t stg 40 to +125 c operating temperature t a 40 to +125 c note: exposure beyond the specified limits may cause permanent damage or degradation to the device. operating characteristics (v s = 5.0 vdc, t a = 25 c unless otherwise noted, p1 > p2. decoupling circuit shown in figure 3 required to meet specification.) characteristic symbol min typ max unit pressure range (1) p op 0 e 10 kpa supply voltage (2) v s 4.75 5.0 5.25 vdc supply current i o e 5.0 10 madc minimum pressure offset (3) (0 to 85 c) @ v s = 5.0 volts v off 0 0.2 0.425 vdc full scale output (4) (0 to 85 c) @ v s = 5.0 volts v fso 4.475 4.7 4.925 vdc full scale span (5) (0 to 85 c) @ v s = 5.0 volts v fss 4.275 4.5 4.725 vdc accuracy (6) (0 to 85 c) e e e 5.0 %v fss sensitivity v/p e 450 e mv/kpa response time (7) t r e 1.0 e ms output source current at full scale output i o+ e 0.1 e madc warmup time (8) e e 20 e ms offset stability (9) e e 0.5 e %v fss notes: 1. 1.0 kpa (kilopascal) equals 0.145 psi. 2. device is ratiometric within this specified excitation range. 3. offset (v off ) is defined as the output voltage at the minimum rated pressure. 4. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. 5. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relationship with pressure over the specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 c. ? tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. ? variation from nominal: the variation from nominal values, for offset or full scale span, as a percent of v fss , at 25 c. 7. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. 8. warmup time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 9. offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test. mechanical characteristics characteristics typ unit weight, basic element (case 867) 4.0 grams weight, basic element (case 482) 1.5 grams 3 motorola sensor device data onchip temperature compensation, calibration and signal conditioning the performance over temperature is achieved by integrat- ing the shearstress strain gauge, temperature compensa- tion, calibration and signal conditioning circuitry onto a single monolithic chip. figure 2 illustrates the differential or gauge configuration in the basic chip carrier (case 482). a fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. the mpx5010 and mpxv5010g series pressure sensor operating characteristics, and internal reliability and qualifi- cation tests are based on use of dry air as the pressure me- dia. media, other than dry air, may have adverse effects on sensor performance and longterm reliability. contact the factory for information regarding media compatibility in your application. figure 3 shows the recommended decoupling circuit for in- terfacing the integrated sensor to the a/d input of a micropro- cessor or microcontroller. proper decoupling of the power supply is recommended. figure 4 shows the sensor output signal relative to pres- sure input. typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85 c using the decoupling circuit shown in figure 4. the output will saturate outside of the specified pressure range. figure 2. crosssectional diagram sop (not to scale) figure 3. recommended power supply decoupling and output filtering. for additional output filtering, please refer to application note an1646. $' 8 #)($)( *: * " *7<; )#&#' #" #( + & #" &"( '"' " !"( ( &!#$ '( ' '( " '' '( $ &! $ $ #" &"( $&'')& 4$. #)($)(* (&"'& )"( #" * 7<; * ' $ &&#& * ' *0/ (!$ ;7 (-$ !, ! " figure 4. output versus pressure differential 4 motorola sensor device data transfer function (mpx5010, mpxv5010g) nominal transfer value: v out = v s x (0.09 x p + 0.04) nominal transfer value: (pressure error x temp. factor x 0.09 x v s ) nominal transfer value: v s = 5.0 v 0.25 vdc temperature error band #$ '"&!$"! % ;7 (15819.;<91 36 mpx5010, mpxv5010g series (15819.;<91 9979 ./;79 pressure error band note: the temperature multiplier is a linear response from 0 to 40 c and from 85 to 125 c. $91::<91 4$. $91::<91 9979 !.= ;7 4$. 4$. $91::<91 9979 4$. 5 motorola sensor device data pressure (p1)/vacuum (p2) side identification table motorola designates the two sides of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing fluoro silicone gel which protects the die from harsh media. the motorola mpx pressure sensor is designed to operate with positive differen- tial pressure applied, p1 > p2. the pressure (p1) side may be identified by using the table below: part number case type pressure (p1) side identifier mpx5010d 867 c stainless steel cap mpx5010dp 867c side with part marking mpx5010gp 867b side with port attached mpx5010gs 867e side with port attached mpx5010gsx 867f side with port attached mpxv5010g6u 482 stainless steel cap mpxv5010g7u 482b stainless steel cap mpxv5010gc6u/t1 482a side with port attached mpxv5010gc7u 482c side with port attached ordering information e unibody package (mpx5010 series) mpx series device type options case type order number device marking basic element differential 867 mpx5010d mpx5010d ported elements differential dual ports 867c mpx5010dp mpx5010dp gauge 867b mpx5010gp mpx5010gp gauge, axial 867e mpx5010gs mpx5010d gauge, axial pc mount 867f mpx5010gsx mpx5010d ordering information e small outline package (mpxv5010g series) device type options case no. mpx series order no. packing options marking basic element gauge, element only, smt 482 mpxv5010g6u rails mpxv5010g gauge, element only, dip 482b mpxv5010g7u rails mpxv5010g ported element gauge, axial port, smt 482a mpxv5010gc6u rails mpxv5010g gauge, axial port, dip 482c mpxv5010gc7u rails mpxv5010g gauge, axial port, smt 482a mpxv5010gc6t1 tape and reel mpxv5010g 6 motorola sensor device data minimum recommended footprint for surface mounted applications surface mount board layout is a critical portion of the total design. the footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. with the correct footprint, the packages will self align when subjected to a solder reflow process. it is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. (-$, (-$, (-$, figure 5. sop footprint (case 482) 36/2 55 ' 7 motorola sensor device data small outline package dimensions case 48201 issue o ' ' "#(' !"' #" " " (# &" " $& "' - ! #"(&# " !"' #" " !"' #" " # "#( " ) !# $&#(&)' #" !, !)! !# $&#(&)' #" *&( ')&' (-$ &( s d g 8 pl n ' ! ' ( a b c m j k pin 1 identifier h t case 482a01 issue a ' ' "#(' !"' #" " " (# &" " $& "' - ! #"(&# " !"' #" " !"' #" " # "#( " ) !# $&#(&)' #" !, !)! !# $&#(&)' #" *&( ')&' (-$ &( s d g 8 pl ' ! ' ( a b c m j k pin 1 identifier h t n v w 8 motorola sensor device data small outline package dimensionsecontinued case 482b03 issue b ' ' "#(' !"' #" " " (# &" " $& "' - ! #"(&# " !"' #" " !"' #" " # "#( " ) !# $&#(&)' #" !, !)! !# $&#(&)' #" *&( ')&' (-$ &( !"' #" ' (# "(& # + " #&! $& pin 1 identifier k t s g a b c m j n d 8 pl ' ! ' ( detail x detail x case 482c03 issue b ' ' "#(' !"' #" " " (# &" " $& "' - ! #"(&# " !"' #" " !"' #" " # "#( " ) !# $&#(&)' #" !, !)! !# $&#(&)' #" *&( ')&' (-$ &( !"' #" ' (# "(& # + " #&! $& pin 1 k t s g a b c n v w m j identifier d 8 pl ' ! ' ( detail x detail x 9 motorola sensor device data unibody package dimensions basic element case 86708 issue n '(- $ " *#)( &#)" * * * *, pin 1 f g n l r c b m j s "#(' !"' #" " " (# &" " $& "' - ! #"(&# " !"' #" " !"' #" ' " )' * # ( !# '(#$ & " !# '(#$ & " "#( (# , a 6 pl d t ! ! ( ' ' "#! "#! '(- $ " #$" &#)" *#)( *')$$ - *#)( #$" '(- $ " #$" &#)" *#)( *')$$ - *#)( #$" positive pressure (p1) pressure side ported (ap, gp) case 867b04 issue f '(- $ " * #)( &#)" * * * * , r n c j pin 1 ! % ! ( b 6x d g f s k v ' $ ! % ' ( l u a "#(' !"' #"' & " ! !(&' !"' #"' " (# &"' $& '! - ! ' ' t p p q q 10 motorola sensor device data unibody package dimensionsecontinued pressure and vacuum sides ported (dp) case 867c05 issue f "#(' !"' #" " " (# &" " $& "' - ! #"(&# " !"' #" " '(- $ " * #)( &#)" * * * * , r x ' ' ' ' port #2 vacuum (p2) port #1 positive port #1 pin 1 port #2 positive vacuum pressure t t p g c j n b f d w v l u 6 pl s k q a ! % ! ( ! ! pressure (p1) (p1) (p2) pressure side ported (as, gs) case 867e03 issue d "#(' !"' #" " " (# &" " $& "' - ! #"(&# " !"' #" " '(- $ " * #)( &#)" * * * * , a c k n e b port #1 positive pressure j t s g f d 6 pl pin 1 ! ! ( ' ' v (p1) 11 motorola sensor device data unibody package dimensionsecontinued pressure side ported (asx, gsx) case 867f03 issue d '(- $ " * #)( &#)" * * * * , "#(' !"' #" " " (# &" " $& "' - ! #"(&# " !"' #" " c e v j port #1 positive pressure t p ! % ! ( d f g 6 pl k s pin 1 u a r b q n ' $ ! % ' ( ' ' (p1) 12 motorola sensor device data motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty, represe ntation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. atypicalo parameters which may be provided in motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. motorola does not convey any license under its patent rights nor the rights of others. motor ola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other ap plications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a s ituation where personal injury or death may occur. should buyer purchase or use motorola products for any such unintended or unauthorized app lication, buyer shall indemnify and hold motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or dea th associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motorola and are registered trademarks of motorola, inc. motorola, inc. is an equal opportunity/affirmative action employer. how to reach us: usa/europe/locations not listed : motorola literature distribution; japan : motorola japan ltd.; sps, technical information center, 3201, p.o. box 5405, denver, colorado 80217. 13036752140 or 18004412447 minamiaz abu. minatoku, tokyo 1068573 japan. 8 1334403569 technical information center: 18005216274 asia/pacific : motorola semiconductors h.k. ltd.; silicon harbour centre, 2, dai king street, tai po industrial estate, tai po, n.t., hong kong. 85226668334 home page : http://www.motorola.com/semiconductors/ mpx5010/d ? |
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